Chapter 1
23
Thermal Design
Item
Description
Thermal Design
T
Thermal solutin should cover Intel (R) 2006 FMB (65W)
requirement
T
2 4-pin smart fan for system
T
1 2-pin fan for north bridge
T
Provision for optional secondary fan
T
Adequate venting in the front of chassis
T
Adequate venting in the rear of chassis
Memory Address Map
Address
Size
Function
0000000 - 009FFFF
640 KB System Memory
Onboard DRAM
00A0000-00BFFFF
128 KB Video RAM
Reserved for Graphics Display
Buffer
Non-Cacheable
00C0000-00CFFFF
32 KB I/O Expansion ROM
Reserved for ROM on I/O
Adapters
00D0000-00D3FFF
16 KB I/O Expansion ROM
Reserved for ROM on I/O
Adapters
00D4000-00D7FFF
16 KB I/O Expansion ROM
Reserved for ROM on I/O
Adapters
00D8000-00DBFFF
16 KB I/O Expansion ROM
Reserved for ROM on I/O
Adapters
00DC000-00DFFFF
16 KB I/O Expansion ROM
Reserved for ROM on I/O
Adapters
00E0000-00E7FFF
32 KB for SCSI BIOS
Reserved for SCSI BIOS
00E8000-00EFFFF
32 KB
Reserved Onboard
00F0000-00FFFFF
64 KB BIOS
System ROM BIOS (ROM)
System RAM BIOS (DRAM)
0100000-0F9FFFF
System Memory
Onboard DRAM
0FA0000-0FFFFFF
384 KB I/O Card Memory
Reserved for Memory Map
I/O Card
Non-Cacheable
1000000-FFFFFFF
System Memory
Onboard DRAM
PCI INTx# and IDSEL Assignment Map
PCI INTx #
PCI Devices
Device IDSEL: ADxx
INTA#
ADIMM-slot
N
INTB#
PCI-Slot1
AD16
INTC#
PCI-Slot2
AD17
Summary of Contents for Aspire L310
Page 20: ...12 Chapter 1...
Page 24: ...16 Chapter 1...
Page 36: ...28 Chapter 1...
Page 42: ...34 Chapter 2 Total Memory Base Upper Extended Total Memory N A Parameter Description Options...
Page 64: ...56 Chapter 2...
Page 104: ...96 Chapter 4...
Page 108: ...100 Chapter 6 AcerPower 2000 Aspire L310 Exploded Diagram...