2101510 Rev. AG
Page 2–11
Of the subassemblies that comprise the analytical module, GC module and
manifold assembly come in two configurations: 12 VDC and 24 VDC.
shows the analytical module assembly removed from the enclosure.
2.3.5.1
Features
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High-speed serial interface to digital controller board
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32-bit digital signal processor
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Flash memory
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Analog to digital conversion circuits
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Digital oven temperature controller
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Digital auxiliary heater controller (optional feed-through heater)
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Dual digital pressure regulators
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Sample pressure sensor
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Pressure sensors (100 PSI max.)
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Thermal conductivity detectors
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System level voltage monitoring
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Analytical processor board level temperature sensor
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LED board status indicators
Figure 2-9 Analytical Module
2.3.5.2
Manifold Assembly
The manifold assembly is comprised of the manifold plate, heater, valves and
various cables to other major components. The manifold plate and heater maintain
constant temperature for the GC module and columns. The valve controls the
stream processing, carrier and calibrations gases. The cables complete the
information chain from the GC module to the analytical processor and the digital
controller assembly.
shows the manifold assembly. This is not a field-replaceable part.