ABACOM Technologies, Inc.
•
383 Bering Ave • Toronto • ON • M8Z 3B1 • Tel +1(416)236-3858 • Fax +1(416)236-8866
www.abacomdirect.com
Description of Main board components
Name
Description
VOLUME
Stereo headphones amplifier volume control
3.5mm STERO JACK
Stereo headphones amplifier volume output decoupled via 100uF capacitors
AUDIO_OUT Dx
Module DAC_R output decoupled via 10uF capacitor
AUDIO_OUT Sx
Module DAC_L output decoupled via 10uF capacitor
Vdc_GND Supply
Supply voltage jack. 7Vdc to 12Vdc, center positive
TACT_SW
Pushbutton to change channel. Connected to TACT_SW pin of the receiver module
USER_BIT
Pin to output serial data, connected to USER_BIT pin of the receiver module
CT_INU
Pin connected to CT_INU pin of the receiver module
DIP SW
10 Position DIP switch. Each switch is connected to the same named pin on the receiver
module. When the switch is closed (ie ON position), the associated line is pulled low.
DIP Switch identification: Transmitter and Receiver
Default: All switches OFF. Please refer to RF module manuals for further details
DIP Switch #
Description
1
OB
Out of Band signal test
2
FORMAT
Signal Scrambling
3
CH-MODE
Selects Tact channel select mode or DIP switch channel select mode.
4
ID0
Used to configure system ID. Only systems with the same ID will output the
transmitted audio signal. 16 possible combinations,
5
ID1
6
ID2
7
ID3
8
SW0
9
SW1
10
SW2
Channel select relative to DIP switch 3. The setting of DIP switch 3 determine
whether these are active or not. Active when DIP switch 3 is in DIP mode.
