ROC254A
User’s Manual
Revision Date: May. 27. 2019
5
Applications, Operating
Applications
Commercial and Military Platforms Requiring Compliance to MIL-STD-810G
Embedded Computing, Process Control, Intelligent Automation and
manufactur-ing applications where Harsh Temperature, Shock, Vibration,
Altitude, Dust and EMI Conditions.
Used in all aspects of the military
Operating System
Windows 10 64Bit, Windows Server 2008 R2, Windows Server 2012 R2
Ubuntu14.04, Fedora 20/23, RedHat Linux EL 7.1/7.2, Vmware ESXi 6.0, ESXi 6.5
Physical
Dimension (W x D x H)
430 x 380 x 44.6mm
Weight
5.75kg(12.68lbs)
Chassis
SECC
Finish
Anodic aluminum oxide (Black)
Cooling
Natural Passive Convection/Conduction. No Moving Parts
Ingress Protection
Dust Proof (Similar to IP50)
Environmental
MIL-STD-810G
Test
Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Operating Temperature
-10 to 60°C (ambient with 0.7m/s airflow)
Storage Temperature
-40 to 85°C
EMC
CE and FCC compliance
*Specifications are subject to change without notice*
