gen
4 Display Module Series gen4-uLCD-24PT - 2.4”
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2017 4D SYSTEMS Page 10 of 22 www.4dsystems.com.au
5.5.
Application PCB Support
The gen4 2.4” Picaso Integrated Display Module is
designed to accommodate a range of applications,
and therefore is suited for those wanting to make a
customised module, without the need for piggy-back
or daughter boards mounted on headers.
On the back of the gen4 module, the display related
circuitry will be found, which is recessed into the
plastic. The level of the plastic on the back of the
gen4 module is higher than the tallest component on
the display circuit PCB, meaning an Application PCB
can be mounted on the back of the gen4, without
affecting the display related circuitry.
The image below shows a mock Application PCB on
the back of the gen4 display (Blue area). It features a
cut-out in the PCB so access to the micro-SD socket
on the gen4’s display board is possible, however this
may or may not be required depending on the
application and if the micro-SD socket is utilised or
requiring access once the Application PCB is applied.
The micro-SD socket is a latch type, so it is accessible
from the top, rather than a push/push or push/pull
style which is accessible from the side.
5.6.
RF / EMI Shielding Support
As per what is written in section 5.5 (Application PCB
Support), there is an option for extended RF shielding
and EMI protection on this module.
On the back of the gen4’s display PCB, are grounded
plated ‘X pads’, which make contact with the metal
housing of the display.
Where the Application PCB is shown to sit in Section
5.5, can house a small metal shield of the same size.
This shield is used instead of, or underneath an
Application PCB, to aid the on-board electronics in
the prevention from potential RF or EMI signals.
On the top of the display PCB is another GND pad,
which can have a pogo pin or similar device mounted
on it, which can make contact with this metal shield.
The display electronics are then sandwiched between
the display’s metal housing, and the metal shield, all
connected together with a common ground.
NOTE: There are no guarantees these steps will
increase chances or grant access to EMI related
certifications, however the gen4 has the capability to
utilise shielding of the modules electronics, should
the need arise. This may or may not assist the User
with protecting the device against EMI/EMF/RF type
noise, depending on the source, strength and type of
noise present, however should aid in the protection.
