Yamato PDC610, Инструкция по эксплуатации

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5
3. MAIN APPLICATIONS
Applications
Applications
The unit is used to plasma-process work pieces to modify their surfaces or to clean them.
The unit has two modes (RIE and DP) to support various applications.
Application of the RIE mode
This mode is used to clean objects whose soil contains inorganic matters as well as organic ones,
or to modify surfaces.
When Ar gas plasma process is performed in the RIE mode, the surface of a work piece put on the
electrode surface will be cleaned with physical action caused by ions accelerated toward it and hit
against it, which is the main feature of this mode. (Because the work piece on the electrode is
processed with Ar ions hit from the above, only its top surface will be processed. The range in
which Ar gas is accelerated is several millimeters above the electrode.
）
＜
Examples of applications
＞
● Improving adhesiveness and
surface modification of different
materials
● Light etching process
● Preprocessing of implementation
board bonding
● Preprocessing of plastic package
● Preprocessing of print board
plating
● Processing of part for LED
related markets
● Cleaning of electronic parts
● Cleaning of optical parts, dies,
machine parts and other
precision parts
● Modification of fluoride or other resin surfaces
Application of the DP mode
This mode is used to clean objects whose soil contains organic ones, or to modify surfaces.
When O
2
gas plasma process is conducted in the DP mode, O
2
plasma acts to organic matters on
the surface of the object, then those organic matters and O
2
radicals will be converted chemically in
vacuum to clean the surface. Because O
2
ions and O
2
radicals in the plasma spread
non-directionally between the electrodes in the DP mode, the whole surface of the work piece
between the electrodes and that contacts the plasma will be processed.
＜
Examples of applications
＞
● Improving adhesiveness and surface
modification of different materials
● Light ashing process
● Preprocessing of plastic package
● Preprocessing of print board plating
● Cleaning of electronic parts
● Cleaning of optical parts, dies,
machine parts and other
precision parts
● Peeling off of resists or removing
residue after wetting process
● Modification of resin surfaces
Ar ion
Matching
unit
ＲＦ
Power
supply
Object
Electrons
Ar ion
Object
Electrons
O
2
ion
O
2
radicals
Matching
unit
ＲＦ
Power
supply
Object (organic)
Electron
CO
2
molecule
O
2
molecule
O
2
ion
O
2
radicals
Object(organic)
Electron
CO
2
molecule
O
2
molecule