WIRELESS CONNECTIVITY & SENSORS
User manual Setebos-I
11 Manufacturing information
11.1 Moisture sensitivity level
This wireless connectivity product is categorized as JEDEC Moisture Sensitivity Level 3 (MSL3),
which requires special handling.
More information regarding the MSL requirements can be found in the IPC/JEDEC J-STD-020
standard on www.jedec.org.
More information about the handling, picking, shipping and the usage of moisture/reflow and/or
process sensitive products can be found in the IPC/JEDEC J-STD-033 standard on
11.2 Soldering
11.2.1 Reflow soldering
Attention must be paid on the thickness of the solder resist between the host PCB top side
and the modules bottom side. Only lead-free assembly is recommended according to JEDEC
J-STD020.
Profile feature
Value
Preheat temperature Min
T
S Min
150 °C
Preheat temperature Max
T
S Max
200 °C
Preheat time from T
S Min
to T
S Max
t
S
60 - 120 seconds
Ramp-up rate (T
L
to T
P
)
3 °C / second max.
Liquidous temperature
T
L
217 °C
Time t
L
maintained above T
L
t
L
60 - 150 seconds
Peak package body temperature
T
P
see table below
Time within 5 °C of actual peak temperature
t
P
20 - 30 seconds
Ramp-down Rate (T
P
to T
L
)
6 °C / second max.
Time 20 °C to T
P
8 minutes max.
Table 12: Classification reflow soldering profile, Note: refer to IPC/JEDEC J-STD-020E
Order code 2611011024020
37
Version 1.1 , July 2022
