User Guide
1. Overview
1.10 ESD
1.10
ESD
The enclosure is designed to dissipate all electrostatic discharge (ESD) to the chassis base. Ensure that
there is sufficient electrical and mechanical connection from the chassis base to the rack rails, and that the
rack itself is tied to earth ground. Precautions must be taken to ensure that the system is not exposed to
ESD while handling components or servicing the unit.
The unit must be grounded in accordance with all local/regional and national electrical codes.
1.11
Enclosure Cooling
The Ultrastar 8 storage subsystem has an advanced thermal algorithm running within the logical
enclosure services process called the SEP that monitors all of the temperature sensors in the enclosure.
The SEP makes adjustments to the fan speeds based upon the thermal sensors. The fan algorithm takes into
account the component and the warning and critical threshold limits defaulted and managed by the SEP
controller. If any temperature sensor exceeds the temperature threshold configured in the SES pages, the
fan speed will increase to cool the enclosure. If the enclosure encounters low temperatures, the enclosure
will reduce fan speed in an attempt to conserve power and not over-cool the enclosure. This algorithm
is agnostic to effects of altitude and humidity. The algorithm works based on temperatures within the
enclosure with emphasis on reducing power consumption.
The server subsystem also has a thermal algorithm that functions similarly to the storage subsystem. The
BMC reads thermal sensors in each of the four memory banks, CPUs, on-board NIC, temperature sensors on
the motherboard, and the IOM SXP temperture, from the BMC itself to react to changing thermal conditions
and adjust the speed of the two server subsystem fan as necessary. The rack that the Ultrastar 8 is
installed in must not restrict airflow to the enclosure. Racks with doors should be tested to ensure they do
not constrict airflow to the enclosure.
The Ultrastar 8 system provides its own cooling using four (4) 80mm fans mounted internally behind
the drive bay and two (2) 80mm fans mounted above the server motherboard in custom fan housings. These
fans draw air from the cold aisle (drive bay side) to the hot isle (server side) through the enclosure. When
the Ultrastar 8 is extended out of the rack, the cover of the enclosure remains inside the rack which
exposes the drives. This feature allows for easier access to drives and simplifies maintenance tasks related
to internal components. However, there is a limit to the amount of time the enclosure can be extended out
of the rack before the enclosure will begin to overheat.
Attention:
Limit the amount of time that the enclosure is extended out of the rack to only
what is necessary to exchange a component or perform regular maintenance and should be
limited to a maximum of 5 minutes total.
Never extend the enclosure out for longer than 5
minutes to prevent overheating.
Only extend the enclosure out of the rack as far as necessary
to service components. The enclosure is equipped with a sensor that will be tripped when the
enclosure's top cover has been opened resulting in the system fans increasing to max speed.
In the event that a fan has failed, it must be replaced before any other CRUs and should be
removed from the enclosure within 30 seconds of removing the enclosure cover.
1.12
List of Compatible Drives
Compatible Drives
19