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Carrier Board Design Guide for SOM-9X35 Module
38
Signal Name
Pin #
I/O
Pad Characteristics
Description
Voltage
Type
LVDS_TX_D2P
J1.44
AO
LVDS display serial interface lane 2 – positive
LVDS_TX_D2N
J1.46
AO
LVDS display serial interface lane 2 – negative
LVDS_TX_D0N
J1.50
AO
LVDS display serial interface lane 0 – negative
LVDS_TX_D0P
J1.52
AO
LVDS display serial interface lane 0 – positive
LVDS_TX_D1N
J1.54
AO
LVDS display serial interface lane 1 – negative
LVDS_TX_D1P
J1.56
AO
LVDS display serial interface lane 1 – positive
DISP_PWM
J1.74
DISP_PWM
1.8V
I, PD
DISP_PWM,LCM Brightness PWM output
LCM_RST
J1.72
LCM_RST
1.8V
I, PD
LCD Reset output, High active
LCM_ENP
J1.70
GPIO116
1.8V
I, PD
LCM power enable output, High active
LCM_ENN
J1.68
GPIO127
1.8V
I, PD
LCM AVDD enable Output, High active
Table 13: LVDS signal definition
Route Differen�ally
Route Differen�ally
Route Differen�ally
Route Differen�ally
LVDS LCD
Connector
SOM-9X35
M.2 Slot
Edg
e fing
er
LVDS_TX_D3P
LVDS_TX_D1N
LVDS_TX_D1P
LCD Control
LVDS_TX_D0P
LVDS_TX_D3N
LVDS_TX_CKP
LVDS_TX_CKN
LVDS_TX_D2P
LVDS_TX_D2N
LVDS_TX_D0N
ESD Protec�on
and Common
Choke
Route Differen�ally
Figure 47: LVDS routing topology
LVDS Signal
Differen�al Pair
S1
S
S
Reference Plane
W
W
Sig M
Sig P
Figure 48: LVDS differential trace width and spacing example
Metrics
Information/Design Guidance
General Information
Data rate
LVDS – 2.1Gbit/s per lane
Impedance
Differential
Main route
100Ω ± 3%
Connector
100Ω ± 10%
Single-ended
Main route
50Ω ± 20%
Connector
50Ω ± 30%