VIA Technologies EPIA-P910, Руководство пользователя

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VIA EPIA-P910 User Manual
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Step 2
Push down the SODIMM memory module until the locking clasps lock the module into place. There will
be a slight tension as the SODIMM memory module is being locked.
Figure 25: Locking the memory module
Step 3
Install the memory thermal pad on the top of the SODIMM memory module.
Figure 26: Installing the memory thermal pad
The memory thermal pad is used for transferring the heat dissipation of memory to the thermal plate or
bottom plate to attain memory cooling, and to ensure the operating temperature of the memory module
should not exceed to 85°C. This helps to prevent damage of the memory module. The memory thermal
pad to be used is requires a certain thickness in order to make contact with the memory thermal plate or
bottom plate to excellently disperse the heat.
Important:
1. The customer/user should consider using the memory thermal pad and adding memory thermal plate or
bottom plate on their chassis design.
2. The memory thermal plate/bottom plate material to be used should have an excellent thermal conductivity.
Avoid using plastic or rubber materials.
3. The thickness of memory thermal pad should be based on customer’s design. However, the minimum value
of thermal conductivity K (W/m.k) is 1.5 and the maximum of hardness is 5 (Shore A).