DE35-ST Operating Instructions
D292469I
7
Introduction & Overview
Overview
The DE35 ST and DE35-300 semi-automatic die pick-and-place systems are a simple low
cost machine for picking die from sawn or scribed wafers mounted on adhesive film. Die
can be placed into waffle packs, gel packs, film frames, or directly onto substrates. The
DE35-ST and DE35-300 will handle die sizes from as small as 0.008 inch square to over 1.0
inch square.
Setup and option information is preserved in non-volatile memory so that following a
weekend shutdown, for example, you can restart the machine without further setup.
Waffle pack pockets for die placement are automatically selected. Manual selection using
the keyboard arrow keys enables completion of partially filled waffle packs. If a grading
output mode is selected, the machine places the die in the next pocket of the
corresponding waffle pack and advises the operator when any of the waffle packs are full.
Standard configuration is for Surface contact pick up, where the die is lifted by an eject
needle and the pickup tip touches the die and holds the die with vacuum. The system is
also available in a Non-Surface Contact, (NSC) configuration. In NSC, the die is picked by
the edges using tweezers like fingers.
Additional options available with the DE35 Series allow for Underside inspection of the
die picked and Facet inspection for Laser Diode operations.
Содержание Royce DE35-ST
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