
17
8
Reflow Soldering
In order to avoid device falling off, the module should be placed on the top of the main
board during soldering. Reflow soldering temperature curve is recommended as shown
in figure 8-1 below (M705-GRN360 is recommended for solder paste).
Note: The module can be soldered only once.
Figure 8-1 Reflow Soldering Line
Note: The apertures in the stencil need to meet the customer's own design requirements
and inspection specifications. The thickness of the stencil should be above 0.15mm, and
0.18mm is recommended.