VISION
UDOO VISION User Manual - Rev. First Edition: 1.0 - Last Edition: 1.0 - Author: A.R. - Reviewed by M.B. Copyright © 2021 SECO S.p.A
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5.1
Thermal Design
A parameter that has to be kept in very high consideration is the thermal design of the system.
Highly integrated modules, like UDOO VISION board, offer to the user very good performances in minimal spaces, therefore allowing the system s minimization. On
the counterpart, the miniaturizing of IC s and the rise of operative frequencies of processors lead to the generation of a big amount of heat, that must be dissipated
to prevent system hang-off or faults.
For this reason, the UDOO VISION system comes along with specific active heatsink.
When using UDOO VISION system, it is necessary to consider carefully the heat generated by the module in the assembled final system, and the scenario of
utilization.
Until the UDOO VISION system is used on a laboratory shelf, on free air, just for software development and system tuning, then the heatsink with integrated fan
mounted on the board could be sufficient for cooling purpose. Anyhow, please remember that all depends also on the workload of the processor. Heavy
computational tasks will generate much heat with all SOCs versions.
Therefore, it is always necessary that the customer studies and develops accurately the cooling solution for his system, by evaluating processor s workload, utilization
scenarios, the enclosures of the system, the air flow and so on.
