TIM-5H
-
Hardware
Integration
Manual
Product
Handling
GPS.G5-MS5-07015-A-1
u-blox
proprietary
Page 35
your position is our focus
3.3.5 Cleaning
In
general,
cleaning
the
populated
modules
is
strongly
discouraged.
Residues
underneath
the
modules
cannot
be
easily
removed
with
a
washing
process.
•
Cleaning
with
water
will
lead
to
capillary
effects
where
water
is
absorbed
in
the
gap
between
the
baseboard
and
the
module.
The
combination
of
residues
of
soldering
flux
and
encapsulated
water
leads
to
short
circuits
or
resistor-like
interconnections
between
neighboring
pads.
Water
will
also
damage
the
sticker
and
the
ink-jet
printed
text.
•
Cleaning
with
alcohol
or
other
organic
solvents
can
result
in
soldering
flux
residues
flooding
into
the
two
housings,
areas
that
are
not
accessible
for
post-wash
inspections.
The
solvent
will
also
damage
the
sticker
and
the
ink-jet
printed
text.
•
Ultrasonic
cleaning
will
permanently
damage
the
module,
in
particular
the
quartz
oscillators.
The
best
approach
is
to
use
a
"no
clean"
soldering
paste
and
eliminate
the
cleaning
step
after
the
soldering.
3.3.6 Repeated Reflow Soldering
Only
a
single
reflow
soldering
process
is
encouraged
for
boards
with
a
TIM-5H
module
populated
on
it.
The
reason
for
this
is
the
risk
of
the
module
falling
off
due
to
high
weight
in
relation
to
the
adhesive
properties
of
the
solder.
3.3.7 Wave Soldering
Base
boards
with
combined
through-hole
technology
(THT)
components
and
surface-mount
technology
(SMT)
devices
require
wave
soldering
to
solder
the
THT
components.
Only
a
single
wave
soldering
process
is
encouraged
for
boards
populated
with
TIM-5H
modules.
3.3.8 Hand Soldering
Hand
soldering
is
allowed.
Use
a
soldering
iron
temperature
setting
of
"7"
which
is
equivalent
to
350°C
and
carry
out
the
hand
soldering
according
to
the
IPC
recommendations
/
reference
documents
IPC7711.
Place
the
module
precisely
on
the
pads.
Start
with
a
cross-diagonal
fixture
soldering
(e.g.
pins
1
and
15),
and
then
continue
from
left
to
right.
3.3.9 Rework
The
TIM-5H
can
be
unsoldered
from
the
baseboard
using
a
hot
air
gun.
Avoid overheating the module.
After
the
module
is
removed,
clean
the
pads
before
placing
and
hand-soldering
a
new
module.
Never attempt a rework on the module itself, e.g. replacing individual components. Such
actions immediately terminate the warranty.
