TIM-5H
-
Hardware
Integration
Manual
Design-In
GPS.G5-MS5-07015-A-1
u-blox
proprietary
Page 18
your position is our focus
2.8.2 Paste Mask
shows
the
recommended
positioning
of
the
Paste
Mask,
the
Copper
and
Solder
masks,
as
well
as
the
step
stencil.
Note
that
the
Copper
and
Solder
masks
have
the
same
size
and
position.
To
improve
the
wetting
of
the
half
vias,
reduce
the
amount
of
solder
paste
under
the
module
and
increase
the
volume
outside
of
the
module
by
defining
the
dimensions
of
the
paste
mask
to
form
a
T-shape
(or
equivalent)
extending
beyond
the
Copper
mask
as
shown
in
In
addition,
use
a
step
stencil
covering
the
entire
area
of
the
module
and
beyond
the
paste
mask
to
increase
the
volume
of
solder
paste
here.
The
solder
paste
at
the
step
stencil
should
have
a
total
thickness
of
175
to
200
μ
m.
If
a
step
stencil
is
not
used
it
is
still
advisable
to
increase
the
volume
of
solder
paste
outside
the
module
to
attain
the
desired
level
of
wetting.
This
must
be
done
by
modifying
the
geometry
of
the
paste
mask
outside
the
module,
to
allow
for
the
increased
volume
of
solder
paste.
Solder
Mask
Copper
Mask
Paste
Mask
1.0
mm
[39mil]
0
.9
m
m
[3
5
m
il]
0.8
mm
[32mil]
minimal
distance
Module
Step
Stencil
Next
Component
Figure 5: Recommendations for copper, solder and paste masks with enlargement
The
paste
mask
outline
needs
to
be
considered
when
defining
the
minimal
distance
to
the
next
component.
The
exact
geometry,
distances,
stencil
thicknesses,
step
heights
and
solder
paste
volumes
must
be
adapted
to
the
specific
production
processes
(e.g.
soldering
etc.)
of
the
customer.
1.0mm
[39mil]
0.
9m
m
[35m
il]
1.3mm [
51mil]
0.8m
m
[32m
il]
0.1mm
[4mil]
0.65mm
[26mil]
1.8mm
[71mil]
0
.65m
m
[26m
il]
