Ublox SARA-G3, Руководство по системной интеграции

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SARA-G3 and SARA-U2 series - System Integration Manual
UBX-13000995 - R08 Objective Specification Design-in
Page 110 of 188
Guidelines for single SIM chip connection
An application circuit for the connection to a single solderable SIM chip (M2M UICC Form Factor) is described in
Figure 55, where the optional SIM detection feature is not implemented (see the circuit described in Figure 56 if
the SIM detection feature is required).
Follow these guidelines connecting the module to a solderable SIM chip without SIM presence detection:

Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the VSIM pin of the module

Connect the UICC / SIM contact C7 (I/O) to the
SIM_IO
pin of the module

Connect the UICC / SIM contact C3 (CLK) to the SIM_CLK pin of the module

Connect the UICC / SIM contact C2 (RST) to the SIM_RST pin of the module

Connect the UICC / SIM contact C5 (GND) to ground

Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line ( VSIM ) close to
the related pad of the SIM chip, to prevent digital noise

Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line
(
VSIM , SIM_CLK , SIM_IO , SIM_RST ), to prevent RF coupling especially in case the RF antenna is placed
closer than 10 - 30 cm from the SIM card holder

Limit capacitance and series resistance on each SIM signal (
SIM_CLK
,
SIM_IO
,
SIM_RST
) to match the
requirements for the SIM interface (27.7 ns is the maximum allowed rise time on the
SIM_CLK
line, 1.0 µs is
the maximum allowed rise time on the SIM_IO and SIM_RST lines)
41 VSIM
39
SIM_IO
38
SIM_CLK
40 SIM_RST
4 V_INT
42
SIM_DET
SIM CHIP
SIM Chip
Bottom View
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3 C5
U1
C4
2
8
3
6
7
1
C1 C5
C2 C6
C3 C7
C4 C8
8
7
6
5 1
2
3
4
TP
SARA-G3 / SARA-U2
Figure 55: Application circuit for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference Description Part Number - Manufacturer
C1, C2, C3, C4 47 pF Capacitor Ceramic C0G 0402 5% 50 V GRM1555C1H470JA01 - Murata
C5 100 nF Capacitor Ceramic X7R 0402 10% 16 V GRM155R71C104KA01 - Murata
U1 SIM chip (M2M UICC Form Factor) Various Manufacturers
Table 28: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented