NINA-B50 series - Hardware integration manual
UBX-22021116 - R02
Design-in
Page 30 of 57
C1-Public
•
Minimum layer count and copper thickness:
4 𝑙𝑎𝑦𝑒𝑟𝑠
,
35 𝜇𝑚
.
•
Minimum board size:
55𝑥70 𝑚𝑚
.
•
To optimize the heat flow from the module, power planes and signal traces should not cross the
layers beneath the module.
These recommendations facilitate a design that can achieve a thermal characterization parameter of
ψ
𝐽𝐵
= 18.2 °𝐶/𝑊
for NINA-B501 and
ψ
𝐽𝐵
= 19.4 °𝐶/𝑊
for NINA-B506,
where
𝐽𝐵
refers to
the “module’s
junction to main PCB bottom side
”
.
Use the following hardware techniques to further improve thermal dissipation in the module and
optimize its performance in customer applications:
•
Maximize the return loss of the antenna to reduce reflected RF power to the module.
•
Improve the efficiency of any component that generates heat, including power supplies and
processor, by dissipating it evenly throughout the application device.
•
Provide sufficient ventilation in the mechanical enclosure of the application.
•
For continuous operation at high temperatures, particularly in high-power density applications or
smaller PCB sizes, include a heat sink on the bottom side of the main PCB. The heat sink is best
connected using electrically insulated / high thermal conductivity adhesive
2
.
3.6
ESD guidelines
Device immunity against Electrostatic Discharge (ESD) is a requirement for Electromagnetic
Compatibility (EMC) conformance and use of the CE marking for products intended for sale in Europe.
To bear the CE mark, all application products integrating u-blox modules must be conformance tested
in accordance with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low
Voltage Directive (73/23/EEC) issued by the Commission of the European Community.
Compliance with the above directives implies conformity to the following European Norms for device
ESD immunity: ESD testing standard CENELEC EN 61000-4-2 and the radio equipment standards
ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24, the requirements of which are
summarized in
The ESD immunity test is performed at the enclosure port, defined by
ETSI EN 301 489-1
as the
physical boundary through which the electromagnetic field radiates. If the device implements an
integral antenna, the enclosure port is seen as all-insulating and includes conductive surfaces to
house the device. If the device implements a removable antenna, the antenna port can be separated
from the enclosure port. The antenna port includes the antenna element and its interconnecting cable
surfaces.
Any extension of the ESD immunity test to the whole device is dependent on the device classification,
as defined by
ETSI EN 301 489-1
. Applicability of ESD immunity test to the related device ports or the
related interconnecting cables to auxiliary equipment, depends on the device accessible interfaces
and manufacturer requirements, as defined by the
ETSI EN 301 489-1
.
Contact discharges are performed at conductive surfaces, while air discharges are performed at
insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal
and vertical coupling planes as defined in the
CENELEC EN 61000-4-2
.
☞
The terms “integral antenna”, “removable antenna”, “antenna port”, “device classification” used
in the context of this guideline are defined in ETSI EN 301 489-
1. The terms “contact discharge”
and “air discharge” are defined in CENELEC EN 61000 4
-2.
2
Typically, not required.
