NINA-B1 series - System integration manual
UBX-15026175 - R16
Design-in
Page 44 of 63
C1-Public
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Particular care should be taken not to place components close to the antenna area. The designer
should carefully follow the recommendations from the antenna manufacturer about the distance
of the antenna vs. other parts of the system. The designer should also maximize the distance of
the antenna to Hi-frequency busses like DDRs and related components or consider an optional
metal shield to reduce interferences that could be picked up by the antenna thus reducing the
module’s sensitivity.
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An optimized module placement allows better RF performance. See Antenna interfaces section for
more information on antenna consideration during module placement.
3.7.3
Layout and manufacturing
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Avoid stubs on high-speed signals. Even through-hole vias may have an impact on signal quality.
•
Verify the recommended maximum signal skew for differential pairs and length matching of buses.
•
Minimize the routing length; longer traces will degrade signal performance. Ensure that maximum
allowable length for high-speed busses is not exceeded.
•
Ensure that you track your impedance matched traces. Consult with your PCB manufacturer early
in the project for proper stack-up definition.
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RF and digital sections should be clearly separated on the board.
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Ground splitting is not allowed below the module.
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Minimize bus length to reduce potential EMI issues from digital busses.
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All traces (including low speed or DC traces) must couple with a reference plane (GND or power);
Hi-speed busses should be referenced to the ground plane. In this case, if the designer needs to
change the ground reference, an adequate number of GND vias must be added in the area of
transition to provide a low impedance path between the two GND layers for the return current.
•
Hi-Speed busses are not allowed to change reference plane. If a reference plane change is
unavoidable, some capacitors should be added in the area to provide a low impedance return path
through the different reference planes.
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Trace routing should keep a distance greater than 3w from the ground plane routing edge.
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Power planes should keep a distance from the PCB edge sufficient to route a ground ring around
the PCB, the ground ring must then be connected to other layers through vias.
3.8
Module footprint and paste mask
The mechanical outline of the NINA-B1 series module can be found in the NINA-B1 series data
sheet [2]. The proposed land pattern layout reflects the pads layout of the module.
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD)
pad type, which implements the solder mask opening 50
μ
m larger per side than the corresponding
copper pad.
The suggested paste mask layout for the NINA-B1 series modules is to follow the copper mask layout
as described in NINA-B1 series data sheet [2].
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These are recommendations only and not specifications. The exact mask geometries, distances,
and stencil thicknesses must be adapted to the specific production processes of the customer.
3.9
Thermal guidelines
NINA-B1 series modules have been successfully tested in -40 °C to +85 °C. NINA-B1 is a low power
device and generates only a small amount of heat during operation. A good grounding should still be
observed for temperature relief during high ambient temperature.
