TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R07
Advance Information
Design-in
Page 127 of 158
For example, the Module-to-Ambient thermal resistance (R
th,M-A
) is strongly reduced with forced air ventilation
and a heat-sink installed on the back of the application board, decreasing the module temperature variation.
Beside the reduction of the Module-to-Ambient thermal resistance implemented by proper application hardware
design, the increase of module temperature can be moderated by proper application software implementation:
Enable power saving configuration using the AT+UPSV command (see section 1.15.18).
Enable module connected-mode for a given time period and then disable it for a time period enough long to
properly mitigate temperature increase.
2.15
ESD guidelines
The sections 2.15.1 and 2.15.2 are related to EMC / ESD immunity. The modules are ESD sensitive devices. The
ESD sensitivity for each pin (as Human Body Model according to JESD22-A114F) is specified in
TOBY-L2 series
Data Sheet
[1] or
MPCI-L2 series Data Sheet
[2]. Special precautions are required when handling the pins; for
ESD handling guidelines see section 3.2.
2.15.1
ESD immunity test overview
The immunity of devices integrating TOBY-L2 and MPCI-L2 series modules to Electro-Static Discharge (ESD) is
part of the Electro-Magnetic Compatibility (EMC) conformity which is required for products bearing the CE
marking, compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the Low Voltage
Directive (73/23/EEC) issued by the Commission of the European Community.
Compliance with these directives implies conformity to the following European Norms for device ESD immunity:
ESD testing standard
CENELEC EN 61000-4-2
[22] and the radio equipment standards
ETSI EN 301 489-1
ETSI EN 301 489-7
ETSI EN 301 489-24
[25], which requirements are summarized in Table 47.
The ESD immunity test is performed at the enclosure port, defined by
ETSI EN 301 489-1
[23] as the physical
boundary through which the electromagnetic field radiates. If the device implements an integral antenna, the
enclosure port is seen as all insulating and conductive surfaces housing the device. If the device implements a
removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the
antenna element and its interconnecting cable surfaces.
The applicability of ESD immunity test to the whole device depends on the device classification as defined by
ETSI
EN 301 489-1
[23]. Applicability of ESD immunity test to the relative device ports or the relative interconnecting
cables to auxiliary equipment, depends on device accessible interfaces and manufacturer requirements, as
defined by
ETSI EN 301 489-1
Contact discharges are performed at conductive surfaces, while air discharges are performed at insulating
surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling
planes as defined in
CENELEC EN 61000-4-2
For the definition of integral antenna, removable antenna, antenna port and device classification see
ETSI
EN 301 489-1
[23]. For the contact / air discharges definitions see
CENELEC EN 61000-4-2
Application
Category
Immunity Level
All exposed surfaces of the radio equipment and ancillary equipment in a
representative configuration
Contact Discharge
4 kV
Air Discharge
8 kV
Table 47: EMC / ESD immunity requirements as defined by CENELEC EN 61000-4-2 and ETSI EN 301 489-1, 301 489-7, 301 489-24