TOBY-L1 and MPCI-L1 series - System Integration Manual
UBX-13001482 - R04
Advance Information
Design-in
Page 65 of 90
2.11
TOBY-L1 series module footprint and paste mask
Figure 40 and Table 24 describe the suggested footprint (i.e. copper mask) layout for TOBY-L1 series modules.
The proposed land pattern layout slightly reflects the modules’ pads layout, with most of the lateral pads
designed wider on the application board (1.8 x 0.8 mm) than on the module (1.5 x 0.8 mm).
I1
A
G
H
J1
D
F2
K
M1 M1
M2
P2
B
G
H
J
O
O
L
N
M1 M1
M3
I1
I1
O
H
J
J
J
E
P3
F1
P1
H
I1
O
I2
I2
F2
Module placement outline
Figure 40: TOBY-L1 module suggest footprint (application board top view)
Parameter
Value
Parameter
Value
Parameter
Value
A
35.6 mm
H
0.80 mm
M2
5.20 mm
B
24.8 mm
I1
1.50 mm
M3
4.50 mm
D
2.40 mm
I2
1.80 mm
N
2.10 mm
E
2.25 mm
J
0.30 mm
O
1.10 mm
F1
1.45 mm
K
3.15 mm
P1
1.10 mm
F2
1.30 mm
L
7.15 mm
P2
1.25 mm
G
1.10 mm
M1
1.80 mm
P3
2.85 mm
Table 24: TOBY-L1 module suggest footprint dimensions
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type,
implementing the solder mask opening 50 µm larger per side than the corresponding copper pad.
The suggested paste mask layout for TOBY-L1 series modules slightly reflects the copper mask layout described
in Figure 40 and Table 24, as different stencil apertures layout for any specific pad is recommended:
•
Blue marked pads: Paste layout reduced circumferentially about 0.025 mm to Copper layout
•
Green marked pads: Paste layout enlarged circumferentially about 0.025 mm to Copper layout
•
Purple marked pads: Paste layout one to one to Copper layout
The recommended solder paste thickness is 150 µm, according to application production process requirements.
These are recommendations only and not specifications. The exact mask geometries, distances and stencil
thicknesses must be adapted to the specific production processes (e.g. soldering etc.) of the customer.
