LEA-6 / NEO-6 / MAX-6 - Hardware Integration Manual
UBX-14054794
Production Information
Product handling
Page 55 of 85
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump
of the paste could become worse.
Limit time above 217°C liquidus temperature: 40 – 60 s
Peak reflow temperature: 245°C
Cooling phase
A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and
possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a
good shape and low contact angle.
Temperature fall rate: max 4°C / s
To avoid falling off, the u-blox 6 GPS module should be placed on the topside of the motherboard during
soldering.
The final soldering temperature chosen at the factory depends on additional external factors like choice of
soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering
temperature in the recommended soldering profile may permanently damage the module.
Figure 55: Recommended soldering profile
u-blox 6 modules
must not
be soldered with a damp heat process.
3.2.3
Optical inspection
After soldering the u-blox 6 module, consider an optical inspection step to check whether:
The module is properly aligned and centered over the pads
All pads are properly soldered
No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby.