LEA-6 / NEO-6 / MAX-6 - Hardware Integration Manual
UBX-14054794
Production Information
Design-in
Page 39 of 85
MAX Form Factor (10.1 x 9.7 x 2.5): Same Pitch as NEO for all pins: 1.1 mm, but 4 pads in each corner
(pin 1, 9, 10 and 18) only 0.7 mm wide instead 0.8 mm
The paste mask outline needs to be considered when defining the minimal distance to the next
component. The exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted
to the specific production processes (e.g. soldering etc.) of the customer.
2.5.2
Placement
A very important factor in achieving maximum performance is the placement of the receiver on the PCB. The
connection to the antenna must be as short as possible to avoid jamming into the very sensitive RF section.
Make sure that RF critical circuits are clearly separated from any other digital circuits on the system board. To
achieve this, position the receiver digital part towards your digital section of the system PCB. Care must also be
exercised with placing the receiver in proximity to circuitry that can emit heat. The RF part of the receiver is very
sensitive to temperature and sudden changes can have an adverse impact on performance.
The RF part of the receiver is a temperature sensitive component. Avoid high temperature drift
and air vents near the receiver.
Non 'emitting'
circuits
PCB
Digital & Analog circuits
Non
'emitting'
circuits
A
n
ten
n
a
Digital Part
RF Part
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
RF & heat
'emitting'
circuits
PCB
Digital & Analog circuits
RF& heat
'emitting'
circuits
A
n
ten
n
a
1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
Figure 35: Placement (for exact pin orientation see data sheet)
