ANNA-B112 - System integration manual
UBX-18009821 - R09
Handling and soldering
Page 49 of 66
C1-Public
4
Handling and soldering
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No natural rubbers, hygroscopic materials or materials containing asbestos are employed.
Packaging, shipping, storage, and moisture preconditioning
For information pertaining to reels, tapes or trays, moisture sensitivity levels (MSL), shipment and
storage, as well as drying for preconditioning refer to ANNA-B112 data sheet [2] and u-blox package
information guide [1].
Handling
ANNA-B112 modules are Electro-Static Discharge (ESD) sensitive devices and require special
precautions during handling. Particular care must be exercised when handling patch antennas, due to
the risk of electrostatic charges. In addition to standard ESD safety practices, the following measures
should be taken into account whenever handling the receiver:
•
Unless there is a galvanic coupling between
the local GND (workbench ground for
example) and the PCB GND, then the first
point of contact when handling the PCB
must always be between the local GND and
PCB GND.
•
Before mounting an antenna patch, connect
ground of the device
•
When handling the RF pin, do not come into
contact with any charged capacitors and be
careful when contacting materials that can
develop charges; for example, patch
antenna (~10 pF), coaxial cable (~50-80
pF/m), soldering iron, and so on.
•
To prevent electrostatic discharge through
the RF input, do not touch any exposed
antenna area. If there is any risk that an
exposed antenna area is touched in
non-ESD protected work area, implement
proper ESD protection measures in the
design.
•
When soldering RF connectors and patch
antennas to the RF pin of the receiver, make
sure to use an ESD-safe soldering iron (tip).
Soldering
4.3.1
Reflow soldering process
ANNA-B112 is a surface-mount module supplied on a FR4-type PCB with gold plated connection
pads. It is manufactured in a lead-free process with a lead-free soldering paste. The bow and twist of
the PCB is maximum 0.75% according to IPC-A-610E. The thickness of solder resist between the host
PCB top side and the bottom side of ANNA-B112 must be considered for the soldering process.
