7
PACKAGING INFORMATION AND PRODUCTION INSTRUCTIONS
they are very likely to get damp when exposed outside. In this case, if they
are soldered at high temperatures, it may result in component failure or
poor soldering.
• In the whole production process, take electrostatic discharge (ESD) protective
measures.
• To guarantee the passing rate, it is recommended that you use the SPI and AOI
to monitor the quality of solder paste printing and mounting.
7.6 Recommended oven temperature curve
Perform mounting with the SMT based on the following reflow oven temperature
curve. The highest temperature is 245°C. The reflow temperature curve is as be-
low:
• A: Temperature axis
• B: Time axis
• C: Liquidus temperature: 217 to 220°C
• D: Ramp-up slope: 1 to 3°C/s
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