6
INFORMATION OF ANTENNAS
3. Bake the module if any of the following conditions is met:
• The vacuum package is damaged before the module is unpacked.
• The package does not contain a humidity indicator card (HIC).
• After the module is unpacked, the HIC shows that the 30% and higher rate
circles are pink.
• Production is not completed within 72 hours after the module is unpacked.
4. Baking settings:
• Baking temperature: 65±5°C in reel pack mode and 125±5°C in tray pack
mode
• Baking time: 48 hours in reel pack mode and 12 hours in tray pack mode
• Alarm temperature: 70°C in reel pack mode and 130°C in tray pack mode
• Production ready temperature after natural cooling: < 36°C
• Number of baking times: 1
• Rebaking condition: Production is not completed within 72 hours after bak-
ing.
5. Do not wave solder modules that have been unpacked for over three months.
Electroless nickel immersion gold (ENIG) is used for the PCBs. If the solder pads
are exposed to the air for over three months, they will be oxidized severely and
dry joints or solder skips may occur. Tuya is not liable for such problems and
consequences.
6. Throughout the production process, take electrostatic discharge (ESD) protec-
tive measures.
7. For a good product quality, ensure that the following items meet requirements:
• Flux amount
• Wave height
• Amount of tin dross and copper in the solder pot
• Wave soldering fixture window and thickness
• Oven temperature curve for wave soldering
6.6 Recommended Oven Temperature Curve
Set the oven temperature to a value recommended for wave soldering. The peak
temperature is 260±5°C.
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