turck TBPN-L5-4FDI-4FDX, Инструкция по эксплуатации

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V01.00 | 2020/07
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5.1.2 Shielding of the fieldbus and I/O level
The fieldbus and the I/O level of the modules can be grounded separately.
1
2
3
Fig. 6: Grounding clip (1), grounding ring (2) and metal screw (3)
The grounding ring (2) is the module grounding. The shielding of the I/O level is permanently
connected to the module grounding. The module grounding is only connected to the refer-
ence potential of the installation when the module is mounted.
Shielding concept of the I/O modules (I/O level)
In the case of direct mounting on a mounting plate, the module grounding is connected to the
reference potential of the system via the metal screw in the lower mounting hole (3). If module
grounding is not desired, the electrical connection to the reference potential must be interrup-
ted, e.g. by using a plastic screw.
Shielding concept of the fieldbus level
On delivery, a grounding clip is provided on the connectors for the fieldbus connection.
When mounted directly on a mounting plate, the shielding of the fieldbus cables is routed dir-
ectly to the module ground via the grounding clip and the metal screw in the lower mounting
hole.
If direct grounding of the fieldbus shield is not desired, the grounding clip must be removed. In
this case, the fieldbus shield is connected to the module ground via an RC element.
5.1.3 Grounding the device – I/O level and fieldbus level
The grounding of the fieldbus level can either be connected directly via the grounding clip (1)
or connected and routed indirectly via an RC element to the grounding of the I/O level. If the
grounding is to be routed via an RC element, the grounding clip must be removed.
1
2
3
Fig. 7: Grounding clamp (1)