User's Manual l TQMx50UC UM 0101 l © 2018 TQ-Group
Page 5
2.2
Specification Compliance
The TQMx50UC is compliant to the PICMG
®
COM Express™ Module Base Specification (COM.0 R2.1) Compact, Type 6,
95 × 95 mm2.
2.3
Versions
The TQMx50UC is available in several standard configurations.
•
TQMx50UC-AC ("Premium")
Intel
®
Core™ i7-5650U (2 × 2.2 GHz / 3.2 GHz Turbo, 4 MB Cache, HD6000 Gfx),
8GB DDR3L-1600, TPM, Standard-Temp. 0 to +60 °C
•
TQMx50UC-AB ("Mainstream")
Intel
®
Core™ i5-5350U (2 × 1.8 GHz / 2.9 GHz Turbo, 3 MB Cache, HD6000 Gfx),
4GB DDR3L-1600, TPM, Standard-Temp. 0 to +60 °C
•
TQMx50UC-AA ("Entry Level")
Intel
®
Core™ i3-5010U (2 × 2.1 GHz, 3 MB Cache, HD5500 Gfx),
4GB DDR3L-1600, Standard-Temp. 0 to +60 °C
•
TQMx50UC-AD ("Basic")
Intel
®
Celeron
®
3765U (2 × 1.7 GHz, 2 MB Cache, HD Gfx),
4GB DDR3L-1600, Standard-Temp. 0 to +60 °C
Please visit to
TQ-Group/TQMx50UC
for a complete list of standard versions.
Other configurations are available on request.
Standard configuration features are:
•
CPU version
•
Memory configuration
•
TPM
•
Temperature range
Optional hardware and software configuration features:
•
Conformal coating can be offered as a customer specific add-on
•
Custom specific GPIO configuration through TQ-flexiCFG
•
4 (×1) PCIe lanes on PCI Express PEG port
•
LVDS / eDP configuration
•
iRTC
•
Custom specific BIOS configuration
For further information regarding other versions, please contact
TQ-Support
.
2.4
Accessories
•
TQMx50UC-HSP (TQMx50UC-HSP-11-M-5083-BL)
Heat spreader for TQMx50UC according to the COM Express™ specification.
•
Evaluation platform MB-COME6-1
Mainboard for COM Express™ Compact Modules, Type 6.
Interfaces: 2 × DP, LVDS, 2 × Gbit Ethernet, 4 × USB, 3 × COM, audio, mini PCIe, mSATA, 2.5” SSD, SD card,
riser extension with PCIe and USB, fan, debug.
Dimensions: 170 × 170 mm2.
