User's Manual l TQMx50UC UM 0101 l © 2018 TQ-Group
Page ii
TABLE OF CONTENTS (continued)
3.6
Connectors................................................................................................................................................................................................. 14
3.6.1
COM Express™ Connector ..................................................................................................................................................................... 14
3.6.2
Debug Header........................................................................................................................................................................................... 14
3.6.3
Debug Module LED ................................................................................................................................................................................. 14
3.7
COM Express™ Connector Pinout List................................................................................................................................................ 14
3.7.1
Signal Assignment Abbreviations....................................................................................................................................................... 14
3.7.2
COM Express™ Connector Pin Assignment...................................................................................................................................... 15
4.
MECHANICS ............................................................................................................................................................................................... 23
4.1
TQMx50UC Dimensions ......................................................................................................................................................................... 23
4.2
Heat Spreader Dimensions ................................................................................................................................................................... 24
4.3
Mechanical and Thermal Aspects ....................................................................................................................................................... 24
4.4
Protection Against External Effects .................................................................................................................................................... 24
5.
SOFTWARE.................................................................................................................................................................................................. 25
5.1
System Resources .................................................................................................................................................................................... 25
5.1.1
I2C Bus .......................................................................................................................................................................................................... 25
5.1.2
SMBus .......................................................................................................................................................................................................... 25
5.1.3
Memory Map ............................................................................................................................................................................................. 25
5.1.4
IRQ Map....................................................................................................................................................................................................... 25
5.2
Operating Systems .................................................................................................................................................................................. 26
5.2.1
Supported Operating Systems............................................................................................................................................................. 26
5.2.2
Driver Download ...................................................................................................................................................................................... 26
5.3
BIOS .............................................................................................................................................................................................................. 26
5.3.1
Enter BIOS Setup ...................................................................................................................................................................................... 26
5.4
Software Tools........................................................................................................................................................................................... 26
6.
SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS......................................................................................................... 27
6.1
EMC............................................................................................................................................................................................................... 27
6.2
ESD................................................................................................................................................................................................................ 27
6.3
Shock & Vibration..................................................................................................................................................................................... 27
6.4
Operational Safety and Personal Security ........................................................................................................................................ 27
6.5
Reliability and Service Life..................................................................................................................................................................... 27
7.
ENVIRONMENT PROTECTION................................................................................................................................................................ 28
7.1
RoHS............................................................................................................................................................................................................. 28
7.2
WEEE
®
.......................................................................................................................................................................................................... 28
7.3
REACH
®
........................................................................................................................................................................................................ 28
7.4
EUP................................................................................................................................................................................................................ 28
7.5
Battery ......................................................................................................................................................................................................... 28
7.6
Packaging ................................................................................................................................................................................................... 28
7.7
Other Entries.............................................................................................................................................................................................. 28
8.
APPENDIX ................................................................................................................................................................................................... 29
8.1
Acronyms and Definitions..................................................................................................................................................................... 29
8.2
References.................................................................................................................................................................................................. 31