User's Manual l TQMx50UC UM 0101 l © 2018 TQ-Group
Page 24
4.2
Heat Spreader Dimensions
The TQMx50UC supports two different heights of heat spreaders:
•
Standard: TQMx50UC-HSP (TQMx50UC-HSP-11-M-…)
The standard version is compliant to the COM Express™ specification with 13 mm (±0.2 mm) (including PCB).
•
Low-Profile: TQMx50UC-HSP-LP (TQMx50UC-HSP-6-M-…)
The low-profile version focuses on low-profile applications: Height reduced to 8 mm (±0.2 mm) (including PCB).
The low-profile heat spreader version is available on request.
The following illustration shows the standard heat spreader (TQMx50UC-HSP) for the TQMx50UC.
Illustration 4:
Standard Heat Spreader “TQMx50UC-HSP”
Please contact
TQ-Support
for more details about 2D/3D Step models.
4.3
Mechanical and Thermal Aspects
The TQMx50UC is designed to operate within a wide range of thermal environments.
An important factor for each system integration is the thermal design. The heat spreader acts as a thermal coupling device to the
TQMx50UC. The heat spreader is thermally coupled to the processor and provides optimal heat transfer from the TQMx50UC to
the heat spreader. The heat spreader itself is not an appropriate heat sink.
System designers can implement different passive and active cooling systems through the thermal connection to the heat
spreader.
Attention: Thermal Considerations
Do not operate the TQMx50UC without properly attached heat spreader or heat sink!
If a special cooling solution must be implemented an extensive thermal design analysis and verification has to be performed.
TQ-Systems GmbH offers thermal analysis and simulation as a service.
Please contact
TQ-Support
for more information about the thermal configuration.
4.4
Protection Against External Effects
The TQMx50UC itself is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system and carrier board.
Conformal coating can be offered for applications in harsh environments.
Please contact
TQ-Support
for further details.
