User's Manual l TQMaRZG2x UM 0100 l © 2021, TQ-Systems GmbH
Page 37
4.6
Thermal management
To cool the TQMaRZG2x, approximately 6 watts must be dissipated; see Table 33 for typical power consumption.
The power dissipation originates primarily in the RZ/G2x, the LPDDR4 SDRAM and the buck regulators.
The power dissipation also depends on the software used and can vary according to the application.
Attention: Destruction or malfunction, TQMaRZG2x heat dissipation
The TQMaRZG2x belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the RZ/G2x must be taken into consideration when
connecting the heat sink. The RZ/G2x is not necessarily the highest component.
Inadequate cooling connections can lead to overheating of the TQMaRZG2x and thus malfunction,
deterioration or destruction.
TQ-Systems offers a heat spreader for the TQMaRZG2H (TQMaRZG2H_HSP) and for the TQMaRZG2M / TQMaRZG2N
(TQMaRZG2M_HSP). Please contact your local sales representative.
4.7
Structural requirements
The TQMaRZG2x is held in the mating connectors by the retention force of the pins (440). For high requirements with respect to
vibration and shock firmness, an additional retainer has to be provided in the final product to hold the TQMaRZG2x in its
position. This can be achieved with the combination of heat sink and mounting method. Since no heavy and large components
are used, there are no further requirements.
4.8
Notes of treatment
To avoid damage caused by mechanical stress, the TQMaRZG2x may only be extracted from the carrier board by using the
extraction tool MOZIaRZG2x that can also be obtained separately.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMaRZG2x
for the extraction tool MOZIaRZG2x.
5.
SOFTWARE
The TQMaRZG2x is delivered with a preinstalled boot loader and a
, which is configured for the
combination of TQMaRZG2x and MBaRZG2x.
The boot loader provides TQMaRZG2x-specific as well as board-specific settings, e.g.:
•
RZ/G2x configuration
•
LPDDR4 SDRAM configuration and timing
•
eMMC configuration
•
Multiplexing
•
Clocks
•
Pin configuration
•
Driver strengths
If a different boot loader is used, these settings have to be adapted accordingly.
More information can be found in the
