User's Manual l TQMa8MxML UM 0103 l © 2022, TQ-Systems GmbH
Page 49
Figure 27: TQMa8MxML dimensions, bottom view
5.
MECHANICS
5.1
Dimensions
Figure 25: TQMa8MxML dimensions, side view
Table 42:
TQMa8MxML heights
Dim.
Value
Tolerance
Remark
A
0.125 mm
+0.075 mm
TQMa8MxML LGA pads height
–0.025 mm
B
1.6 mm
±0.16 mm
PCB without solder resist
C
1.25 mm
±0.11 mm
Height CPU soldered
C1
1.22 mm
±0.05 mm
Highest component, top side
D
0.57 mm
±0.2 mm
Highest component, bottom side
E
3 mm
±0.2 mm
Top edge CPU with soldered TQMa8MxML. Referenced to top edge of carrier board.
Figure 26: TQMa8MxML dimensions, top view