User's Manual l TQMLS10xxA UM 0105 l © 2022, TQ-Systems GmbH
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9.
APPENDIX
9.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 16:
Acronyms
Acronym
Meaning
BGA
Ball Grid Array
BIOS
Basic Input/Output System
BSP
Board Support Package
CPLD
Complex Programmable Logic Device
CPU
Central Processing Unit
DC
Direct Current
DDR
Double Data Rate
DUART
Debug UART
ECC
Error Checking and Correction
EEPROM
Electrically Erasable Programmable Read-only Memory
EMC
Electromagnetic Compatibility
eMMC
embedded Multi-Media Card
ESD
Electrostatic Discharge
eSDHC
enhanced Secure Digital High Capacity
EU
European Union
EuP
Energy using Products
FC-PBGA
Flip-Chip Plastic Ball Grid Array
FR-4
Flame Retardant 4
GPIO
General Purpose Input/Output
HCSL
Host Clock Signal Level
HDLC
High-level Data Link Control
I/D
Instruction / Data
I/O
Input/Output
I
2
C
Inter-Integrated Circuit
IFC
Integrated Flash-Controller
IIC
Inter-Integrated Circuit
IP00
Ingress Protection 00
JTAG
®
Joint Test Action Group
LED
Light Emitting Diode
LPUART
Low Power UART
LVDS
Low Voltage Differential Signal
MAC
Media Access Control
MOZI
Module extractor (Modulzieher)
MTBF
Mean operating Time Between Failures