User's Manual l MBa6ULxL UM 0101 l © 2018, TQ-Systems GmbH
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10.
APPENDIX
10.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 29:
Acronyms
Acronym
Meaning
ADC
Analog/Digital Converter
BGA
Ball Grid Array
BIOS
Basic Input/Output System
CAN
Controller Area Network
CPU
Central Processing Unit
DDR3L
Double Data Rate 3 Low voltage
DHCP
Dynamic Host Configuration Protocol
DIP
Dual In-line Package
EDT
Emerging Display Technology
EEPROM
Electrically Erasable Programmable Read-only Memory
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
eMMC
embedded Multimedia Card
ESD
Electrostatic Discharge
EuP
Energy using Products
FFC
Flat Flex Cable
FR-4
Flame Retardant 4
FS
Full Speed (USB: 12 Mbit/s)
FTDI
Future Technology Devices International
GPIO
General-Purpose Input/Output
GSM
Global System for Mobile Communications (Groupe Spécial Mobile)
HDMI
High Definition Multimedia Interface
HID
Human Interface Devices
HSYNC
Horizontal Synchronisation
I
Input
I/O
Input/Output
I
2
C
Inter-Integrated Circuit
ICMP
Internet Control Message Protocol [Novell]
IEEE
Institute of Electrical and Electronics Engineers
IP
Internet Protocol
IP00
Ingress Protection 00
ITU-R
International Telecommunication Union-Recommendation
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LGA
Land Grid Array
LoRa
Long Range
LSB
Least Significant Bit
MAC
Media Access Control
MSB
Most Significant Bit
NC
Not Connected
NOR
Not-Or
NUC
Next Unit of Computing