TQ MB-SMARC-3, Руководство пользователя

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User's Manual l MB-SMARC-3 UM 0100 l © 2022, TQ-Systems GmbH Page 25
8. APPENDIX
8.1 Acronyms and Definitions
The following acronyms and abbreviations are used in this document.
Table 21: Acronyms
Acronym Meaning
ATA Advanced Technology Attachment
BIOS Basic Input/Output System
CAN Controller Area Network
CSI Camera Serial Interface (MIPI)
DIP Dual In-line Package
DP Display Port
DVI Digital Visual Interface
EDID Extended Display Identification Data
eDP embedded Display Port
EEPROM Electrically Erasable Programmable Read-Only Memory
EMC Electromagnetic Compatibility
ESD Electrostatic Discharge
EuP Energy using Products
FAE Field Application Engineer
flexiCFG Flexible Configuration
FR-4 Flame Retardant 4
FTDI Future Technology Devices International
GPIO General-Purpose Input/Output
HD High Definition (Audio)
HDA High-Definition Audio (Intel)
HDMI High Definition Multimedia Interface
HPD Hot Plug Detect
I/O Input/Output
I2C Inter-Integrated Circuit
I2S Integrated Interchip Sound
IEEE
®
Institute of Electrical and Electronics Engineers
IP Ingress Protection
LCD Liquid Crystal Display
LED Light Emitting Diode
LTE Long Term Evolution
LVDS Low Voltage Differential Signal
MIPI Mobile Industry Processor Interface
mPCIe Mini Peripheral Component Interconnect Express
MTBF Mean (operating) Time Between Failures
NC Not Connected
OTG On-The-Go