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Preliminary User's Manual l TQMLS1028A UM 0001 l © 2019, TQ-Systems GmbH
Page 22
5.5
Adaptation to the environment
The TQMLS1028A overall dimensions (length × width) are 80 × 60 mm
2
.
The CPU on the TQMLS1028A has a maximum height of approximately 8.6 mm above the MBLS1028A.
The TQMLS1028A weighs approximately 33 grams.
5.6
Protection against external effects
As an embedded module, the TQMLS1028A is not protected against dust, external impact and contact (IP00).
Adequate protection has to be guaranteed by the surrounding system.
5.7
Thermal management
To cool the TQMLS1028A, a theoretical maximum of approximately 18 W have to be dissipated.
The power dissipation originates primarily in the CPU and the DDR4 SDRAM.
The power dissipation also depends on the software used and can vary according to the application.
Attention: Destruction or malfunction
The TQMLS1028A belongs to a performance category in which a cooling system is essential in most
applications. It is the user’s sole responsibility to define a suitable heat sink (weight and mounting
position) depending on the specific mode of operation (e.g., dependence on clock frequency, stack
height, airflow, and software). Particularly the tolerance chain (PCB thickness, board warpage, BGA
balls, BGA package, thermal pad, heatsink) as well as the maximum pressure on the LS1028A must be
taken into consideration when connecting the heat sink, see (2).
The LS1028A is not necessarily the highest component. Inadequate cooling connections can lead to
overheating of the TQMLS1028A and thus malfunction, deterioration or destruction.
5.8
Structural requirements
The TQMLS1028A is held in the mating connectors by the retention force of the pins (240). If high requirements are set for
vibration and shock resistance, additional fastening may be necessary.
5.9
Notes of treatment
To avoid damage caused by mechanical stress, the TQMLS1028A may only be extracted from the carrier board by using the
extraction tool MOZI8XX that can also be obtained separately.
Attention: Component placement on the carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the TQMLS1028A
for the extraction tool MOZI8XX.
6.
SOFTWARE
The TQMLS1028A is delivered with a preinstalled boot loader and a BSP, which is configured for the Starterkit MBLS1028A.
The boot loader provides TQMLS1028A-specific as well as board-specific settings, e.g.:
•
CPU configuration
•
PMIC configuration
•
DDR4 SDRAM configuration and timing
•
eMMC configuration
•
Multiplexing
•
Clocks
•
Pin configuration
•
Driver strengths
More information can be found in the