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User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH
Page 46
9.
APPENDIX
9.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document:
Table 30:
Acronyms
Acronym
Meaning
BGA
Ball Grid Array
BIOS
Basic Input/Output System
CAN
Controller Area Network
CAUI
100 Gigabit Attachment Unit Interface
CPLD
Complex Programmable Logic Device
CPU
Central Processing Unit
DC
Direct Current
DIP
Dual In-line Package
DNC
Do Not Connect
EEPROM
Electrically erasable programmable read-only memory
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
eMMC
embedded Multimedia Card (Flash)
ESD
Electrostatic Discharge
EuP
Energy using Products
FR-4
Flame Retardant 4
GP
General Purpose
GPIO
General Purpose Input/Output
I/O
Input/Output
I²C
Inter-Integrated Circuit
IEEE
®
Institute of Electrical and Electronics Engineers
IP00
Ingress Protection 00
JTAG
®
Joint Test Action Group
LED
Light Emitting Diode
LP_DDR4
Double Data Rate 4
LVDS
Low-Voltage Differential Signaling
MOZI
Modulzieher (module extractor)
mPCIe
Mini Peripheral Component Interconnect Express
MTBF
Mean (operating) Time Between Failures
NAND
Not-And (flash memory)
NC
Not Connected
NOR
Not-Or
OLED
Organic Light-Emitting Diode
OTG
On-the-Go
PCB
Printed Circuit Board
PCI
Peripheral Component Interconnect
PCIe
Peripheral Component Interconnect express
PCMCIA
People Can’t Memorize Computer Industry Acronyms
PD
Pull-Down
PHY
Physical (layer of the OSI model)
PMC
Power Management Controller
PU
Pull-Up