User's Manual l MBLX2160A UM 0101 l © 2022, TQ-Systems GmbH
Page 41
5.
MECHANICS
5.1
TQMLX2160A and MBLX2160A dimensions
Figure 40:
MBLX2160A dimensions (± 0,1 mm)
5.2
Notes of treatment
The TQMLX2160A is held in its mating connectors with a considerable retention force.
To avoid damage caused by mechanical stress, the TQMLX2160A may only be extracted from the MBLX2160A by using the
extraction tool MOZILX2160A that can be obtained separately.
Note: Component placement on carrier board
2.5 mm should be kept free on the carrier board, on both long sides of the MBLX2160A
for the extraction tool MOZILX2160A.
5.3
Thermal management
The TQMLX2160A on the MBLX2160A has a maximum peak power consumption of approximately 60 W.
Further power consumption occurs mainly at externally connected devices.
Attention: Destruction or malfunction, TQMLX2160A heat dissipation
The TQMLX2160A belongs to a performance category in which a cooling system is essential.
It is the user’s sole responsibility to define a suitable heat sink (weight and mounting position)
depending on the specific mode of operation (e.g., dependence on clock frequency, stack height,
airflow, and software).
Particularly the tolerance chain (PCB thickness, board warpage, BGA balls, BGA package, thermal pad,
heatsink) as well as the maximum pressure on the LX2160A must be taken into consideration when
connecting the heat sink.
The LX2160A is the highest component on the TQMLX2160A. Inadequate cooling connections
can lead to overheating of the TQMLX2160A and thus malfunction, deterioration or destruction.
