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User's Manual l MBa335x UM 0202 l © 2018, TQ-Systems GmbH
Page 55
10.
APPENDIX
10.1
Acronyms and definitions
The following acronyms and abbreviations are used in this document.
Table 87:
Acronyms
Acronym
Meaning
ADC
Analog/Digital Converter
BIOS
Basic Input/Output System
BSP
Board Support Package
CAN
Controller Area Network
CPU
Central Processing Unit
DDR3L
DDR3 Low Voltage
DIN
German industry standard (Deutsche Industrie Norm)
DIP
Dual In-line Package
EEPROM
Electrically Erasable Programmable Read-Only Memory
EMC
Electromagnetic Compatibility
EMI
Electromagnetic Interference
eMMC
embedded Multimedia Card (Flash)
EN
European standard (Europäische Norm)
ESD
Electrostatic Discharge
EuP
Energy using Products
FET
Field Effect Transistor
FFC
Flat Flex Cable
FR-4
Flame Retardant 4
GPIO
General Purpose Input/Output
HP
Headphone
I/O
Input/Output
I
2
C
Inter-Integrated Circuit
IEEE
®
Institute of Electrical and Electronics Engineers
IP00
Ingress Protection 00
JTAG
®
Joint Test Action Group
LCD
Liquid Crystal Display
LED
Light Emitting Diode
LSB
Least Significant Bit
LVDS
Low Voltage Differential Signal
MCASP
Multichannel Audio Serial Port
MII
Media Independent Interface
MMC
Multimedia Card
MSB
Most Significant Bit
MTBF
Mean operating Time Between Failures