SDRAM 128Mb F-die (x4, x8, x16)
CMOS SDRAM
Rev. 1.2 August 2004
DQ BUFFER OUTPUT DRIVE CHARACTERISTICS
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Notes
Output rise time
trh
Measure in linear
region : 1.2V ~ 1.8V
1.37
4.37
Volts/ns
3
Output fall time
tfh
Measure in linear
region : 1.2V ~ 1.8V
1.30
3.8
Volts/ns
3
Output rise time
trh
Measure in linear
region : 1.2V ~ 1.8V
2.8
3.9
5.6
Volts/ns
1,2
Output fall time
tfh
Measure in linear
region : 1.2V ~ 1.8V
2.0
2.9
5.0
Volts/ns
1,2
1. Rise time specification based on 0pF + 50
Ω
to V
SS
, use these values to design to.
2. Fall time specification based on 0pF + 50
Ω
to V
DD
, use these values to design to.
3. Measured into 50pF only, use these values to characterize to.
4. All measurements done with respect to V
SS
.
Notes :
1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
Notes :
AC CHARACTERISTICS
(AC operating conditions unless otherwise noted)
Parameter
Symbol
- 60 (x16 only)
- 75
Unit
Note
Min
Max
Min
Max
CLK cycle
time
CAS latency=3
t
CC
6
1000
7.5
1000
ns
1
CAS latency=2
-
10
CLK to valid
output delay
CAS latency=3
t
SAC
5
5.4
ns
1,2
CAS latency=2
-
6
Output data
hold time
CAS latency=3
t
OH
2.5
3
ns
2
CAS latency=2
-
3
CLK high pulse width
t
CH
2.5
2.5
ns
3
CLK low pulse width
t
CL
2.5
2.5
ns
3
Input setup time
t
SS
1.5
1.5
ns
3
Input hold time
t
SH
1
0.8
ns
3
CLK to output in Low-Z
t
SLZ
1
1
ns
2
CLK to output
in Hi-Z
CAS latency=3
t
SHZ
5
5.4
ns
CAS latency=2
-
6