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User’s Guide

TPS65251 Buck Converter Evaluation Module User's
Guide

Table of Contents

1 Introduction

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2 Background

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3 Schematic

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4 Placement (Top Layer)

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5 Bench Test Setup Conditions

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5.1 Headers Description and Jumper Placement.....................................................................................................................

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5.2 Jumpers..............................................................................................................................................................................

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5.3 Test Points and Placement.................................................................................................................................................

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6 Power-Up Procedure

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7 Bill of Materials

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8 Revision History

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Trademarks

All trademarks are the property of their respective owners.

www.ti.com

Table of Contents

SLVU399B – AUGUST 2010 – REVISED MAY 2021

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TPS65251 Buck Converter Evaluation Module User's Guide

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Содержание TPS65251

Страница 1: ...tion and Jumper Placement 7 5 2 Jumpers 8 5 3 Test Points and Placement 8 6 Power Up Procedure 9 7 Bill of Materials 10 8 Revision History 11 Trademarks All trademarks are the property of their respec...

Страница 2: ...65251 PMIC as well as the support documentation including schematic and bill of materials Introduction www ti com 2 TPS65251 Buck Converter Evaluation Module User s Guide SLVU399B AUGUST 2010 REVISED...

Страница 3: ...Output Current Summary EVM TEST CONDITIONS OUTPUT CURRENT RANGE TPS65251EVM VIN 4 5 V to 13 V fsw 500 kHz Buck1 1 2 V 3 A Buck2 1 8 V 2 A Buck3 3 3 V 2 A 25 C ambient This evaluation module is designe...

Страница 4: ...se of gains phase measurements R10 R19 and R21 0 on the EVM need to be replaced by suitable low value resistors as per the network analyzer setup required Test points are provided on either end of the...

Страница 5: ...TP2 GND TP12 VOUT2 TP5 VOUT1 TP10 FB1A TP16 FB2A TP8 FB3A TP4 VOUT3 TP33 V3V JP1 GND GND GND TP28 TP29 TP27 1 2 3 J1 VOUT1 GND GND 4 7uH L2 TDK SLF7055 4 7uH L1 TDK SLF7055 VOUT1 VOUT2 VOUT3 PGOOD 1...

Страница 6: ...ure 4 1 Placement Top Layer Placement Top Layer www ti com 6 TPS65251 Buck Converter Evaluation Module User s Guide SLVU399B AUGUST 2010 REVISED MAY 2021 Submit Document Feedback Copyright 2021 Texas...

Страница 7: ...P SYNC Figure 5 1 Headers Description and Jumper Placement Test points Black GND White Each output feed back power good and VIN All marking on PCB www ti com Bench Test Setup Conditions SLVU399B AUGU...

Страница 8: ...r must be fitted 5 3 Test Points and Placement Buck converter outputs are red and have a label for easy location Close to any of these test points there are black ground test points to allow for DVM m...

Страница 9: ...are powered up by the output voltages The whole start up process will take around 100 ms PGOOD will be asserted after 1 s 4 Apply loads to the output connectors 5 For low power and SYNC operation remo...

Страница 10: ...00 10 064 10 0010 00 SIP HEADER STRAIGHT PCB JUMPER 2 PIN 13 3 JP2 JP3 JP4 JMP0 3 Mil Max 800 10 064 10 0010 00 SIP HEADER STRAIGHT PCB JUMPER 2 PIN 14 3 L1 L2 L3 4 7 H IND_SLF7055 TDK Corporation SLF...

Страница 11: ...MINI 040 D WHITE Glass Beaded Test Point 28 1 U1 QFN 40 TI TPS65251 8 Revision History NOTE Page numbers for previous revisions may differ from page numbers in the current version Changes from Revisio...

Страница 12: ...ther than TI b the nonconformity resulted from User s design specifications or instructions for such EVMs or improper system design or c User has not paid on time Testing and other quality control tec...

Страница 13: ...These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not in...

Страница 14: ...instructions set forth by Radio Law of Japan which includes but is not limited to the instructions below with respect to EVMs which for the avoidance of doubt are stated strictly for convenience and s...

Страница 15: ...any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electr...

Страница 16: ...R DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT 9 Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthe...

Страница 17: ...are subject to change without notice TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource Other reproduction and...

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