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EXAMPLE BOARD LAYOUT
(7.5)
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
32X (1.5)
32X (0.45)
30X (0.65)
(R0.05) TYP
(3.04)
(3.74)
(5.2)
NOTE 9
(11)
NOTE 9
(
0.2) TYP
VIA
(1.2 TYP)
(0.65) TYP
(1.3) TYP
PowerPAD TSSOP - 1.2 mm max height
DAP0032C
PLASTIC SMALL OUTLINE
4223691/A 05/2017
SYMM
SYMM
SEE DETAILS
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
1
16
17
32
METAL COVERED
BY SOLDER MASK
SOLDER MASK
DEFINED PAD
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
8. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
numbers SLMA002 (www.ti.com/lit/slma002) and SLMA004 (www.ti.com/lit/slma004).
9. Size of metal pad may vary due to creepage requirement.
TM
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
EXPOSED METAL
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL