FR-4 (Er = 4.8)
10 mil
Top Layer
RF Ground Plane]
FR4 (Er = 4.8)
23 mil
Power Plane #1
FR4
23 mil
Bottom Layer
6
2
.2
mi
l t
h
ick
PCB Layers Stackup
10
SNAU114D – March 2006 – Revised June 2016
Copyright © 2006–2016, Texas Instruments Incorporated
Using the LMX2485E & LMX2487E Evaluation Board
4
PCB Layers Stackup
6-layer PCB Stackup includes:
•
Top Layer for high-priority high-frequency signals (2 oz)
•
FR4 Dielectric, 10 mils
•
RF Ground plane (1 oz)
•
FR4, 23 mils
•
Power plane #1 (1 oz)
•
FR4, 23 mils
•
Bottom Layer copper clad for thermal relief (2 oz)
Figure 7. PCB Layers
