LMK033x8 EVALUATION MODULE (EVM)
H1
NY PMS 440 0025 PH
H2
NY PMS 440 0025 PH
H3
NY PMS 440 0025 PH
H4
NY PMS 440 0025 PH
H7
1902C
H8
1902C
H10
1902C
H11
1902C
LOGO
PCB
Texas I nstruments
FID2
FID3
FID1
SV601123
A
PCB Number:
PCB Rev:
PCB Label
LBL1
Size: 0.65" x 0.20 "
DNP
HARDWARE AND MARKINGS
H5
NY PMS 440 0025 PH
H6
NY PMS 440 0025 PH
H9
1902C
H12
1902C
LAYOUT NOTE:
Place 6 standoffs at corners of the board .
PCB DIMENSIONS, STACKUP, CONT ROLLED IMPEDANCE
DIMENSIONS:
- OCTOGON shape with 3" sides with equal length
- Final PCB thickness 62 mil +/- 10%
STACKUP: 8 layers
--- Layer 1: Device layer with Digital routing, Signal/Power Jumpers/Switches, Crystal, RF microstrip traces from DUT to SMAs, Ground flood
===== FR4: 7 mil
--- Layer 2: Ground Plane
===== FR4: 7 mil
--- Layer 3: Ground Plane
===== FR4: 5 mil
--- Layer 4: Digital and Power routing, Ground flood
===== FR4: 16 mil
--- Layer 5: Split Power plane
===== FR4: 5 mil
--- Layer 6: Ground Plane
=====FR406: 7 mil
--- Layer 7: Ground Plane
===== FR406: 7 mil
--- Layer 8: RF microstrip traces from SMAs to DUT, Digital and Power routing, Ground flood
CONTROLLED IMPEDANCE TRACES:
-- EXTERNAL 11 mil traces to be 50 ohm Zo +/- 10%
-- INTERNAL 6 mil traces to be 50 ohm Zo +/- 10%
-- TOP 25 mil traces to be 50 ohm Zo +/- 10%, ref to Layer 3 (plane cutout on Layer 2)
-- BOTTOM 25 mil traces to be 50 ohm Zo +/- 10%, ref to Layer 6 (plane cutout on Layer 7)
GROUND VIA STITCHING:
-- Use ground vias with 100 mil spacing to stitch ground shielding around RF microstrip traces from DUT to SMAs.
-- Use ground vias with 400 mil spacing to stich ground planes/floods across the rest of board.
FID5
FID6
FID4
FID8
FID7
LOGO
PCB
Pb-Free Symbol
LOGO
PCB
FCC disclaimer
EVM Schematic
7
EVM Schematic
33
SNAU184 – August 2015
LMK03328EVM User’s Guide
Copyright © 2015, Texas Instruments Incorporated