LM61460EVM Board Test Results
10
SNVU621C – May 2019 – Revised December 2019
Copyright © 2019, Texas Instruments Incorporated
LM61460-Q1 EVM User's Guide
Figure 11. Bottom Layer
Figure 12. Bottom 3D view
6
LM61460EVM Board Test Results
6.1
Thermals
A thermal image of the IC was captured to determine rise in-temp with a 5 V, 6 A load. The device was
soaked for 30 minutes to obtain accurate measurement.
Figure 13. Thermal Image Capture of IC at VIN = 13.5 V, VOUT = 5 V, Load = 6 A
NOTE:
Thermal image captures top of case temperature. This is essentially junction temperature as
the case package is very thin, resulting in low psi-jt. This demonstrates device capability of
operating greater than 85°C ambient with headroom.
6.2
EMI
The EMI measurements were taken following CISPR 25, Class 5 standards. The measurements were
taken at 13.5 VIN, 5 VOUT with a 6 A load.