Introduction
2
SLVUBD4A – January 2018 – Revised December 2018
Copyright © 2018, Texas Instruments Incorporated
High Side Switch Motherboard Evaluation Module
1
Introduction
Texas Instruments' HSS-MOTHERBOARDEVM evaluation module has a central socket for the supporting
daughtercard with the high side switch device to be populated. The EVM supports the entire single-
channel and dual channel low Ron (
≤
50-m
Ω
) high-side driver applications. The purpose of this EVM is to
facilitate evaluation of the low Ron high side switches for the diagnostic features and drive resistive,
capacitive, and inductive loads.
The EVM is a combination of a central motherboard and a row of daughterboards. The mother board has
all connectors, jumpers, and test points. The daughter board has different footprints to support the low
Ron family of TI's high side switch portfolio. The daughter board also has limiting resistors for the channel
devices (TPS
2
HBxx-Q1) and since the 1 channel device (TPS
1
HA08-Q1) has a NC pin in that location the
daughtercards will work for all of the devices.
The daughterboards have 2 different footprints: 24 pin PWP and 16 pin PWP. For installation, a single
board from the panel has to broken, a device soldered down onto the main footprint, and connected to the
motherboard.
NOTE:
Caution must be taken when soldering down the device as the main power pad on the back
needs to be soldered correctly as to not affect performance. Please see
app note for more details about the solder profile and
techniques.
The current-limiting resistors are on the bottom side of the daughterboard. They are all 10-k
Ω
, 0805
package. For the desired current limit value, the resistor can be replaced with different value. Also for the
single channel devices the second resistor should be depopulated.
The jumpers are not installed. Refer to
and
for installation.
1.1
Descriptions
The Texas Instruments HSS-MOTHERBOARDEVM helps designers evaluate the operation and
performance of the TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1, TPS2HB35-Q1 and TPS2HB50-Q1
devices.
These devices are fully-protected high-side switches, with an integrated NMOS power FET, and charge
pump. Full diagnostics and high-accuracy current sense features enable intelligent control of the load.
The device diagnostic reporting supports load current status and device temperature on an analog sense
output pin SNS. The SNS pin sources a current proportional to the selected parameter. By adding a
pulldown resistor on the SNS pin, the developed voltage is proportional to the selected parameter as well.
The diagnostics can be disabled for multiplexing the sense pin between different devices.
1.2
Applications
The EVM is used in the following applications:
•
High-side relay drivers
•
High-side power switch for submodule power supply
•
Bulb driver
•
General resistive, inductive, and capacitive loads
•
Replace electromechanical relays and fuses
