User’s Guide
BQ25172EVM Evaluation Module
ABSTRACT
This user’s guide describes the characteristics, operation, and use of the BQ25172EVM evaluation module
(EVM). This EVM is designed to help the user evaluate and test the various operating modes of the BQ25172.
This user’s guide includes setup instructions for the hardware and software, a schematic diagram, a bill of
materials (BOM), and PCB layout drawings for the evaluation module.
Throughout this user's guide, the abbreviations
EVM
,
BQ25172EVM, BMS033
, and the term
evaluation module
are synonymous with the BMS033 evaluation module, unless otherwise noted.
Table of Contents
1 Introduction
.............................................................................................................................................................................
2
1.1 Printed Circuit Board Assembly.........................................................................................................................................
2
1.2 I/O Descriptions..................................................................................................................................................................
2
2 Test Summary
.........................................................................................................................................................................
3
2.1 Equipment..........................................................................................................................................................................
3
2.2 Cautions.............................................................................................................................................................................
3
2.3 Test Instructions.................................................................................................................................................................
3
3 Board Layout, Schematic, and Bill of Materials
...................................................................................................................
4
3.1 Board Layout......................................................................................................................................................................
4
3.2 Schematic..........................................................................................................................................................................
7
3.3 Bill of Materials...................................................................................................................................................................
8
4 Revision History
...................................................................................................................................................................
12
Trademarks
All trademarks are the property of their respective owners.
WARNING
Hot surface! Contact may cause burns. Do not touch!
Some components may reach high temperatures >55°C when the board is powered on. The user must
not touch the board at any point during operation or immediately after operating, as high temperatures
may be present.
www.ti.com
Table of Contents
SLUUCO1 – JULY 2022
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