4.2
Bill of Materials and Schematic
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Circuit Module Physical Layouts and Bill of Materials
Figure 4. Bottom Layer
Figure 5. Bottom Assembly
Table 3. Bill of Materials
Count
RefDes
Description
Size
Mfr
Part Number
21
C1–C9, C12,
Capacitor, Ceramic, 0.1
µ
F, 50 V, X7R, 20%
0603
Any
STD
C13, C15–C18,
C23, C24,
C26–C28
1
C11
Capacitor, Ceramic, 0.22
µ
F, 50 V, X7R, 20%
0603
Any
STD
1
C19
Capacitor, Ceramic, 4.7
µ
F, 10 V, X7R, 20%
0603
Any
STD
1
C20
Capacitor, Ceramic, 47nF, 50 V, X7R, 20%
0603
Any
STD
2
C22, C25
Capacitor, Ceramic, 0.47
µ
F, 16 V, X7R, 20%
0603
Any
STD
3
C10, C14, C21
Capacitor, Ceramic, 1.0
µ
F, 25 V, X7R, 20%
0805
Any
STD
4
D1–D3, D11
Diode, Switching, 150-mA, 75-V, 350mW
SOT23
Vishay-Liteon
BAS16
2
D4, D5
Diode, Dual, Zener, 5.6V, 300mW
SOT23
Vishay-
AZ23C5V6
Telefunken
5
D6–D10
Diode, LED, Green, Gullwing, GW Type, 20ma, 7.5
0.120
×
0.087
Panasonic
LN1361C
mcd typ.
inches
1
J1
Header, Friction Lock Ass'y, 4-pin Right Angle,
0.400
×
0.500
Molex
22-05-3041
1
Q1
MOSFET, N-ch, 20-V, 1.3A, 0.16-
Ω
SOT23
Fairchild
NDS331N
2
Q2, Q4
MOSFET, N-ch Logic Level, Power Trench, 30V, 11A,
SO8
Fairchild
FDS6690A
12.5 m
Ω
SLUU353 – June 2009
bq20z65EVM-001 SBS 1.1 Impedance Track™ Technology
5
Enabled Battery Management Solution Evaluation Module