Schematic, Board Layers, and Bill of Materials
19
SLOU515 – July 2019
Copyright © 2019, Texas Instruments Incorporated
DRV2625 Haptics BoosterPack™ Plug-In Module
8.2
PCB Layers
Figure 17. Top Overlay
Figure 18. Bottom Overlay
Figure 19. Top Layer
Figure 20. Bottom Layer
8.3
Bill of Materials
Table 3. Bill of Materials
Designator
Qty
Value
Description
Package Reference
Part Number
Manufacturer
!PCB
1
Printed Circuit Board
AMPS057
Any
B1
1
Vibrator, 205 Hz. SMT
Dia 10mm
BVW-1034
Bluecom Co.
Ltd
C1, C3, C6
3
0.1µF
CAP, CERM, 0.1 uF, 50 V, +/- 10%, X7R,
0402
0402
C1005X7R1H104K050BB
TDK
C2, C4
2
470pF
CAP, CERM, 470 pF, 25 V, +/- 5%,
C0G/NP0, 0402
0402
GRM1555C1E471JA01D
MuRata