Telit Wireless Solutions SL876Q5-A, Руководство пользователя

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SL876Q5-A Product User Guide
1VV0301333 Rev. 2
Page 58 of 68
2017-06-27
Moisture Sensitivity
Precautionary measures are required in handling, storing and using these devices to avoid
damage from moisture absorption. If localized heating is required to rework or repair the
device, precautionary methods are required to avoid exposure to solder reflow temperatures
that can result in performance degradation.
The SL876Q5-A module has a moisture sensitivity level rating of 3 as defined by IPC/JEDEC
J-STD-020 . This rating is assigned due to some of the components used within the module.
The SL876Q5-A packaging is hermetically sealed with desiccant and humidity indicator card.
The SL876Q5-A parts must be placed and reflowed within 168 hours of first opening the
hermetic seal provided the factory conditions are less than 30°C and less than 60% and the
humidity indicator card indicates less than 10% relative humidity.
If the package has been opened or the humidity indicator card indicates above 10%, then the
parts must be baked prior to reflow. The parts may be baked at +125°C ± 5°C for 48 hours.
However, the tape and reel cannot withstand that temperature. Lower temperature baking is
feasible if the humidity level is low and time is available. Please see
IPC/JEDEC J-STD-033
for additional information.
Additional information can be found on the MSL tag affixed to the outside of the hermetically
sealed bag.
JEDEC standards are available free of charge from the JEDEC website http://www.jedec.org .
Figure 13-3 Moisture-Sensitive Device Label