Telit Wireless Solutions BlueMod+S50, Руководство пользователя по оборудованию

Страница: 39 / 60

S50 Hardware User Guide
1VV0301505 Rev. 3
Page 39 of 60 2021-05-05
Not Subject to NDA
7.4. AI Layout and Placement Recommendation
S50/AI comprises a ceramic antenna, which as a component is soldered to the
circuit board. The performance of the antenna must be checked within the final
integration environment. Adjacent PCBs, components, cables, housings etc. could
otherwise influence the radiation pattern or be influenced by the radio wave energy.
To achieve best radio performance for S50/AI, it is recommended to use the
placement and layout shown in Figure 23 and Figure 24.
This is a “corner placement”
meaning the module is placed such that the antenna comes close to the corner of the
application PCB (red area). So, the yellow area is outside the PCB and regards to the
housing, too (refer to 7.6).
Please note that for best possible performance the antenna should be directed away from
the application PCB as shown in Figure 23.
max.0,5
4,5
10
10
m
ax
.0
,5
10
15
no bare copper (exept solder pads for module)
no copper and components on any layer
no components on any layer
provide solid ground plane(s) as large as possible around
17
do not place any conductive parts in this area
20
20
40
area
Applic. PCB
Figure 23: AI Placement Recommendation
Figure 24: AI Layout Recommendation